Electroplating
Electroplating
Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. This is an introduction to "Electroplating." Processing that involves placing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. ■□■ Features ■□■ ■ Introduction of a plating system compatible with 6-inch wafers ■ While film formation by vapor deposition is usually less than 1μm, plating can form films of several μm ■ Suitable for processing three-dimensional shapes ■ As a metal film, it can be used for circuit formation requiring specific film thicknesses or as a sacrificial film for lift-off, and it is also possible to form fine bumps by raising part of the pattern ■ For other functions and details, please download the catalog or contact us.
- Company：フォトプレシジョン
- Price：Other
